Updated guidelines for stencil design and aperture reduction.
One of the most significant updates is the recommendation for Solder Mask Defined thermal pads. This design uses solder mask "dams" to prevent solder from flowing down open via holes during reflow, eliminating the costly need to plug or tent vias.
AXI is mandatory for verifying BTC compliance. IPC-7093A aligns with IPC-A-610 criteria regarding maximum acceptable voiding limits.
One of the primary reasons engineers download an is to understand voiding limits. The standard defines: ipc-7093a pdf
Whether you are a design engineer creating the PCB footprint, a process engineer responsible for assembly yields, or a quality manager ensuring long-term product reliability, this standard offers the structured, step-by-step guidance you need. Its comprehensive coverage of BTC technology, from fundamental definitions to advanced troubleshooting, makes it a cornerstone document for electronics manufacturing.
By investing in this standard, manufacturers, designers, and engineers gain access to a wealth of collective industry knowledge, enabling them to:
Because the solder joints are located under the component, standard automated optical inspection (AOI) is often insufficient. Updated guidelines for stencil design and aperture reduction
: Best practices for solder paste printing, stencil design (such as "window pane" apertures), and component placement.
The "A" in IPC-7093A signifies that this document is a major revision of the original IPC-7093 standard. Officially released in October 2020, this update is described as a of the previous version.
: Guidance on the number and spacing of vias to balance thermal conductivity with manufacturing costs. AXI is mandatory for verifying BTC compliance
Filling vias with epoxy and plating copper over them. This is the gold standard for high-reliability BTC design.
The , titled "Design and Assembly Process Implementation for Bottom Termination Components (BTCs)," is the definitive industry standard for leadless surface-mount packages. Released in October 2020 as a complete overhaul of the original 2011 version, this revision provides a step-by-step framework for engineers to handle the thermal, electrical, and mechanical challenges inherent in modern component miniaturization. What are Bottom Termination Components (BTCs)?
IPC released to deliver a complete overhaul of the older document. The updated version addresses several advancements in PCB manufacturing:
standard is a comprehensive overhaul of the original IPC-7093, specifically focusing on the design and assembly process implementation for Bottom Termination Components (BTCs) like QFN, DFN, and LGA packages I-Connect007 Key Features of IPC-7093A BTC-Specific Guidance
Something went wrong with the response, but here are the most relevant results: electronics.org·https://www.electronics.org IPC - 7093A - Global Electronics Association